I wasn't suggesting there would be any disintegration. Just that off substrate memory will be reintroduced in-addition to HBM.
If you need a point of reference take a look at L2 cache. It was originally chips on the motherboard, then with the PII it was put on a Processor Card, then with the PIII it was eventually integrated into the Die.
If you need a point of reference take a look at L2 cache. It was originally chips on the motherboard, then with the PII it was put on a Processor Card, then with the PIII it was eventually integrated into the Die.
The exact same thing happened with L3 cache.