> If you want the bare chips and not full assembled labels the usual packaging is uncut wafer and cutting out and handling the individual dies is your problem.

This does not match my experience, although I imagine it's true in some parts of the industry. I've seen bare dice usually delivered as KGDs (known good dice -- tested at the individual level, not just the wafer level). These used to be shipped in waffle packs, but I've more recently seen blue tape used for delivery, and going straight into pick-and-place.