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Perhaps leading to fewer failures and longer device lifespans.

As far as I understand, the less components and heat, the longer the electronics keep working.



That isn't "less components", that's same components but soldered so customers can't replace it.


It removes connectors and may remove buffers. It is hard to pop a memory SIMM out over time using a laptop if everything is soldered in.


not that I've heard of anyone popping out a DIMM over time, but I'd rather pop it back in rather than having to ship it to a repair shop with BGA workstation to replace if a DRAM chip develops fault over time.




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